Operating Conditions

Standard operating conditions (0°C ~ 55°C) — 80°C max FPGA temperature

Applies to ClosedPC1629 Coaxlink Duo PCIe/104-EMB, PC1630 Coaxlink Mono, PC1631 Coaxlink Duo, PC1632 Coaxlink Quad, PC1633 Coaxlink Quad G3, PC1635 Coaxlink Quad G3 DF, PC1637 Coaxlink Quad 3D-LLE, PC3623 Coaxlink Quad CXP-12 Value, PC3624 Coaxlink Quad CXP-12 DF, PC3633 Coaxlink Quad CXP-12 3D-LLE and PC3625 Coaxlink QSFP+.

Parameter Conditions Min Max Units
FPGA die temperature     80 [176] °C [°F]
Ambient air temperature   0 [32] 55 [131] °C [°F]
Ambient air humidity Non-condensing 10 90 % RH

Standard operating conditions (0°C ~ 55°C) — 95°C max FPGA temperature

Applies to ClosedPC3602 Coaxlink Octo, PC3603 Coaxlink Quad CXP-12, PC3603-4 Coaxlink Quad CXP-12, PC3620 Coaxlink Quad CXP-12 JPEG, PC3620-4 Coaxlink Quad CXP-12 JPEG, PC3621 Coaxlink Mono CXP-12 and PC3622 Coaxlink Duo CXP-12.

Parameter Conditions Min Max Units
FPGA die temperature     95 [203] °C [°F]
Ambient air temperature   0 [32] 55 [131] °C [°F]
Ambient air humidity Non-condensing 10 90 % RH

Standard operating conditions (0°C ~ 55°C) — 80°C max FPGA temperature — 250 lfm min. airflow

Applies to ClosedPC1633-LH Coaxlink Quad G3 LH.

Parameter Conditions Min Max Units
FPGA die temperature     80 [176] °C [°F]
Ambient air temperature 150 LFM minimum
required airflow		 0 [32] 55 [131] °C [°F]
Ambient air humidity Non-condensing 10 90 % RH

Standard operating conditions (0°C ~ 55°C) — 95°C max FPGA temperature — 150 lfm min. airflow

Applies to ClosedPC3621-LH Coaxlink Mono CXP-12 LH.

Parameter Conditions Min Max Units
FPGA die temperature     95 [203] °C [°F]
Ambient air temperature 150 LFM minimum
required airflow		 0 [32] 55 [131] °C [°F]
Ambient air humidity Non-condensing 10 90 % RH

Standard operating conditions (0°C ~ 55°C) — 95°C max FPGA temperature — 250 lfm min. airflow

Applies to ClosedPC3622-LH Coaxlink Duo CXP-12 LH.

Parameter Conditions Min Max Units
FPGA die temperature     95 [203] °C [°F]
Ambient air temperature 250 LFM minimum
required airflow		 0 [32] 55 [131] °C [°F]
Ambient air humidity Non-condensing 10 90 % RH

Standard operating conditions (0°C ~ 55°C)

Applies to ClosedPC1625 DB25F I/O Adapter Cable, PC1636 InterPC C2C-Link Adapter, PC3300 HD26F I/O module for Coaxlink Duo PCIe/104, PC3301 Thermal drain (Model 1) for Coaxlink Duo PCIe/104, PC3302 DIN1.0/2.3 Coaxial cable for Coaxlink Duo PCIe/104, PC3303 C2C-Link Ribbon Cable, PC3304 HD26F I/O Adapter Cable, PC3610 HD26F I/O Extension Module - TTL-RS422, PC3612 HD26F I/O Extension Module - TTL-CMOS5V-RS422, PC3613 JTAG Adapter Xilinx for Coaxlink, PC3614 HD26F I/O Extension Module - Standard I/O Set and PC3618 HD26F I/O Extension Module - Fast I/O.

Parameter Conditions Min Max Units
Ambient air temperature   0 [32] 55 [131] °C [°F]
Ambient air humidity Non-condensing 10 90 % RH
● The thermal design of the host PC must ensure that, at any time, the FPGA die temperature never exceeds the recommended limit.
● Exceeding the upper limit of the FPGA die temperature can permanently damage the card.