Operating Conditions

Standard operating conditions (0°C ~ 55°C) — 80°C max FPGA temperature

Applies to Closed1629 Coaxlink Duo PCIe/104-EMB, 1630 Coaxlink Mono, 1631 Coaxlink Duo, 1632 Coaxlink Quad, 1633 Coaxlink Quad G3, 1635 Coaxlink Quad G3 DF, 1637 Coaxlink Quad 3D-LLE, 3623 Coaxlink Quad CXP-12 Value, 3624 Coaxlink Quad CXP-12 DF and 3625 Coaxlink QSFP+.

Parameter Conditions Min Max Units
FPGA die temperature     80 [176] °C [°F]
Ambient air temperature   0 [32] 55 [131] °C [°F]
Ambient air humidity Non-condensing 10 90 % RH

Standard operating conditions (0°C ~ 55°C) — 95°C max FPGA temperature

Applies to Closed3602 Coaxlink Octo, 3603 Coaxlink Quad CXP-12, 3603-4 Coaxlink Quad CXP-12, 3620 Coaxlink Quad CXP-12 JPEG, 3620-4 Coaxlink Quad CXP-12 JPEG, 3621 Coaxlink Mono CXP-12 and 3622 Coaxlink Duo CXP-12.

Parameter Conditions Min Max Units
FPGA die temperature     95 [203] °C [°F]
Ambient air temperature   0 [32] 55 [131] °C [°F]
Ambient air humidity Non-condensing 10 90 % RH

Standard operating conditions (0°C ~ 55°C) — 80°C max FPGA temperature — 250 lfm min. airflow

Applies to Closed1633-LH Coaxlink Quad G3 LH.

Parameter Conditions Min Max Units
FPGA die temperature     80 [176] °C [°F]
Ambient air temperature 150 LFM minimum
required airflow		 0 [32] 55 [131] °C [°F]
Ambient air humidity Non-condensing 10 90 % RH

Standard operating conditions (0°C ~ 55°C) — 95°C max FPGA temperature — 150 lfm min. airflow

Applies to Closed3621-LH Coaxlink Mono CXP-12 LH.

Parameter Conditions Min Max Units
FPGA die temperature     95 [203] °C [°F]
Ambient air temperature 150 LFM minimum
required airflow		 0 [32] 55 [131] °C [°F]
Ambient air humidity Non-condensing 10 90 % RH

Standard operating conditions (0°C ~ 55°C) — 95°C max FPGA temperature — 250 lfm min. airflow

Applies to Closed3622-LH Coaxlink Duo CXP-12 LH.

Parameter Conditions Min Max Units
FPGA die temperature     95 [203] °C [°F]
Ambient air temperature 250 LFM minimum
required airflow		 0 [32] 55 [131] °C [°F]
Ambient air humidity Non-condensing 10 90 % RH

Standard operating conditions (0°C ~ 55°C)

Applies to Closed1625 DB25F I/O Adapter Cable, 1636 InterPC C2C-Link Adapter, 3300 HD26F I/O module for Coaxlink Duo PCIe/104, 3301 Thermal drain (Model 1) for Coaxlink Duo PCIe/104, 3302 DIN1.0/2.3 Coaxial cable for Coaxlink Duo PCIe/104, 3303 C2C-Link Ribbon Cable, 3304 HD26F I/O Adapter Cable, 3610 HD26F I/O Extension Module - TTL-RS422, 3612 HD26F I/O Extension Module - TTL-CMOS5V-RS422, 3613 JTAG Adapter Xilinx for Coaxlink, 3614 HD26F I/O Extension Module - Standard I/O Set and 3618 HD26F I/O Extension Module - Fast I/O.

Parameter Conditions Min Max Units
Ambient air temperature   0 [32] 55 [131] °C [°F]
Ambient air humidity Non-condensing 10 90 % RH

The thermal design of the host PC must ensure that, at any time, the FPGA die temperature never exceeds the recommended limit.

Exceeding the upper limit of the FPGA die temperature can permanently damage the card.