Operating Conditions
Derated operating conditions (0°C ~ 50°C) — 80°C max FPGA temperature
FPGA die temperature |
|
|
80 [176] |
°C [°F] |
Ambient air temperature |
|
0 [32] |
50 [122] |
°C [°F] |
Ambient air humidity |
Non-condensing |
10 |
90 |
% RH |
Standard operating conditions (0°C ~ 55°C)
Applies to 1625 DB25F I/O Adapter Cable, 1636 InterPC C2C-Link Adapter, 3300 HD26F I/O module for Coaxlink Duo PCIe/104, 3301 Thermal drain (Model 1) for Coaxlink Duo PCIe/104, 3302 DIN1.0/2.3 Coaxial cable for Coaxlink Duo PCIe/104, 3303 C2C-Link Ribbon Cable, 3304 HD26F I/O Adapter Cable, 3610 HD26F I/O Extension Module - TTL-RS422, 3612 HD26F I/O Extension Module - TTL-CMOS5V-RS422, 3613 JTAG Adapter Xilinx for Coaxlink, 3614 HD26F I/O Extension Module - Standard I/O Set and 3618 HD26F I/O Extension Module - Fast I/O.
Ambient air temperature |
|
0 [32] |
55 [131] |
°C [°F] |
Ambient air humidity |
Non-condensing |
10 |
90 |
% RH |
The thermal design of the host PC must ensure that, at any time, the FPGA die temperature never exceeds the recommended
limit.
Exceeding the upper limit of the FPGA die temperature can permanently damage the card.